| 摘要 |
PROBLEM TO BE SOLVED: To provide an Sn-plated material which retains excellent solderability and low contact resistance even when exposed to a high-temperature environment, and shows low insertion/extraction properties. SOLUTION: The Sn-plated material has sequentially a primary Ni-plated layer, an intermediate Sn-Cu-plated layer, and a surface Sn-plated layer on the surface of copper or a copper alloy. The primary Ni-plated layer is formed of Ni or an Ni alloy. The intermediate Sn-Cu-plated layer is formed of an Sn-Cu-based alloy and has an Sn-Cu-Zn alloy layer formed at least on the side of contacting the surface Sn-plated layer. The surface Sn-plated layer is formed of an Sn alloy containing 5 to 1,000 mass ppm of Zn. COPYRIGHT: (C)2009,JPO&INPIT
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