| 发明名称 |
DIE STACKING SYSTEM AND METHOD |
| 摘要 |
Die stacking systems and methods are disclosed. In an embodiment, a die has a surface that includes a passivation area, at least one conductive bond pad area, and a conductive stacked die receiving area sized to receive at least a second die. |
| 申请公布号 |
WO2008144573(A2) |
申请公布日期 |
2008.11.27 |
| 申请号 |
WO2008US63993 |
申请日期 |
2008.05.16 |
| 申请人 |
QUALCOMM INCORPORATED;SANCHEZ, HENRY;SHARMA, LAXMINARAYAN |
发明人 |
SANCHEZ, HENRY;SHARMA, LAXMINARAYAN |
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