| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power module that can receive advantages of miniaturization achieved in a semiconductor switching element and an increase in current and has a power feed/distribution path without causing any problems due to solder flow, to provide a manufacturing method of the power module, and to provide a bus bar for connecting elements. <P>SOLUTION: The power module comprises a conductor 21 for feeding/distributing power, the semiconductor switching element 3, and the bus bar 5 for connecting the elements for connecting the semiconductor switching elements. The bus bar for connecting the elements is joined to the semiconductor switching element 3 and at the same time is fixed to the conductor 21 for feeding/distributing power. It is fixed by arrangement adjustment fixation sections 5a, 21a for arrangement adjustment fixation provided at the bus bar for connecting elements and the conductor for feeding/distributing power. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
