发明名称 |
Solid-state imaging device, its production method, camera with the solid-state imaging device and light-receiving chip |
摘要 |
Provided is a light-receiving chip whose transparent protection plate has an area equal to or smaller than an area of the light-receiving chip, and which does not require a base portion for mounting. Provision of the light-receiving chip contributes to reduction in size and weight of cameras. In addition, provision of a solid-state imaging apparatus having excellent productivity contributes to reduction in price of cameras. A solid-state imaging apparatus (10) having: a solid-state imaging device (11) (a light-receiving chip) provided with a plurality of light-receiving cells arranged either one dimensionally or two dimensionally on one main surface of a base substrate; and a transparent protection plate (12) provided to cover a light-receiving area (18) (the plurality of light-receiving cells), where an area of the transparent protection plate is equal to or smaller than an area of the light-receiving chip, and a space (20) is formed between the light-receiving cells and the transparent protection plate. |
申请公布号 |
EP1981084(A2) |
申请公布日期 |
2008.10.15 |
申请号 |
EP20080011555 |
申请日期 |
2004.12.17 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MURATA, TAKAHIKO;KASUGA, SHIGETAKA;YAMAGUTI, TAKUMI |
分类号 |
H01L27/146;H01L23/02;H01L27/14;H01L31/02;H01L31/0203;H04N5/225 |
主分类号 |
H01L27/146 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|