发明名称 |
SUBSTRATE FOR THIN CHIP PACKAGINGS |
摘要 |
A substrate for chip packaging comprises a carrier layer, an etching stopper and an active layer. The carrier layer is made of a conductive metal sheet with a predetermined thickness. The etching stopper is disposed on a side of the carrier layer. The active layer is made of conductive metal materials and disposed on a free side of the etching stopper in a wiring pattern formed by an etching process operating on the active layer.
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申请公布号 |
US2008248270(A1) |
申请公布日期 |
2008.10.09 |
申请号 |
US20080972343 |
申请日期 |
2008.01.10 |
申请人 |
BIAR JEFF;HUANG CHIH-KUNG |
发明人 |
BIAR JEFF;HUANG CHIH-KUNG |
分类号 |
H01L29/12 |
主分类号 |
H01L29/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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