发明名称 |
LEADFRAME BASED FLASH MEMORY CARDS |
摘要 |
A leadframe design and methods for forming leadframe-based semiconductor packages having curvilinear shapes is disclosed. The leadframes may each include one or more curvilinear slots corresponding to curvilinear edges in the finished and singulated semiconductor package. After encapsulation, the integrated circuit packages on the panel may be singulated by cutting the integrated circuits from the leadframe panel into a plurality of individual integrated circuit packages. The slots in the leadframe advantageously allow each leadframe to be singulated using a saw blade making only straight cuts. |
申请公布号 |
KR20080085902(A) |
申请公布日期 |
2008.09.24 |
申请号 |
KR20087018744 |
申请日期 |
2006.12.27 |
申请人 |
SANDISK CORPORATION |
发明人 |
TAKIAR HEM;BHAGATH SHRIKAR |
分类号 |
H01L23/495;H01L21/60;H01L23/48 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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