| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for simulating the shape of a formed film, which can precisely predict the thickness of the film, and to provide a method for manufacturing an electronic device using the same. SOLUTION: The method for simulating the shape of the formed film, which calculates the thickness of the thin film formed by supplying deposition seeds onto the surface of a substrate, includes changing a parameter used for calculation according to the thickness of the deposited thin film. The method for manufacturing an electronic device according to another aspect includes determining a deposition condition for the thin film by using the above method for simulating the shape of the formed film, and then depositing the thin film according to the determined condition. COPYRIGHT: (C)2008,JPO&INPIT
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