| 摘要 |
PROBLEM TO BE SOLVED: To provide an MEMS device thin and high in durability. SOLUTION: The desired and optimum shape is selected by manufacturing a cover 300 to cover a main surface on the part loading side of a circuit substrate 200 by isotropic etching from a metal material, and the small and thin cover 300 is provided. For example, an R part which is a first reinforcing part 303 is formed on a corner part of a space formed by selectively removing an unnecessary part of the metal material, and a thick part is formed as a second reinforcing part 304 by selectively making a side wall part 302 of the cover 300 thick by etching. Additionally, a wall part for reinforcement to restrain deflection of a top plate part 301 is formed as a third reinforcing part 305 nearly on a central part of the top plate part 301 of the cover 300 or in its neighborhood by etching. COPYRIGHT: (C)2008,JPO&INPIT
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