发明名称 Method of manufacturing semiconductor device, method of manufacturing semiconductor substrate and semiconductor substrate
摘要 A semiconductor substrate with an insulating film, a barrier layer containing a metal and formed over the insulating film in a region that includes a peripheral edge part of a semiconductor substrate, a capacitor lower electrode layer formed on the barrier layer and having an edge-cut on the peripheral edge part of the semiconductor substrate, an oxide layer formed on the barrier layer at the peripheral edge part where the barrier layer is not covered by the lower electrode layer, a ferroelectric layer formed on the lower electrode layer and the oxide layer, and a capacitor upper electrode layer formed over the ferroelectric layer.
申请公布号 US2008191254(A1) 申请公布日期 2008.08.14
申请号 US20080068916 申请日期 2008.02.13
申请人 FUJITSU LIMITED 发明人 MATSUURA OSAMU
分类号 H01L29/92;H01L21/00 主分类号 H01L29/92
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