| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a semiconductor element in which heat generated from a semiconductor chip such as an LED chip can be dissipated efficiently. <P>SOLUTION: The LED (semiconductor element) 10 comprises a substantially ringlike frame 18 made of resin and having a hole 16, a first lead frame 20 made of a conductive material of good thermal conductivity and having a disklike forward end portion 20a covering the footprint 18a of the frame 18 substantially entirely and a rear end portion 20b being taken outward in the horizontal direction while penetrating the frame 18, and an LED chip 24 arranged at the forward end portion 20a of the first lead frame 20 exposed in the hole 16. <P>COPYRIGHT: (C)2008,JPO&INPIT |
