MULTILAYER WIRING BOARD, AND POWER SUPPLY STRUCTURE TO BE EMBEDDED IN MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring board capable of supplying sufficient electric power to a circuit element such as an IC chip.

SOLUTION: A multilayer wiring board 10 includes: a core board 11; a buildup layer 31 disposed on an upper surface 12 of the core board 11; a buildup layer 32 disposed on a lower surface 13 of the core board 11; and a power supply structure 51 embedded in a through-hole 57 penetrating the core board 11 and the buildup layers 31 and 32. The power supply structure 51 includes: a conductive metal rod 52 made of copper as a main material; a conductive metal tube 53 made of copper as a main material and provided coaxially with the conductive metal rod 52; and an insulating material 54 filling a gap between the conductive metal rod 52 and the conductive metal tube 53.

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