| 摘要 |
A mini-sized heat-dissipating module includes a miniature heat-dissipating plate and a miniature fan unit. The miniature heat-dissipating plate has an assembling space, at least one airflow channel and at least one engaging portion. The assembling space and the airflow channel are provided on a top surface of the miniature heat-dissipating plate, wherein the assembling space is arranged at an end of the airflow channel. The miniature fan unit has an air inlet, an air outlet, a fan wheel and at least one engaging portion. The engaging portion of the miniature fan unit is engaged with that of the miniature heat-dissipating plate when assembled. An adhesive layer is further provided to combine the miniature fan unit with the miniature heat-dissipating plate.
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