| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring circuit board with high reliability to ensure no swelling or peel-off on metal wiring layers formed on an insulating resin layer. SOLUTION: A multilayer wiring circuit board is composed by forming first and second wiring layers 12a and 12b in order with an insulating resin layer 13a interposed between each of the wiring layers 12a and 12b on one main face side of a silicon substrate. Escape holes 14 for gas components discharged from the insulating resin layer 13a are provided on the second wiring layer 12b. COPYRIGHT: (C)2008,JPO&INPIT |
