| 摘要 |
PROBLEM TO BE SOLVED: To enhance the adhesion of a resist to the top of a wafer and to improve plating resistance in a conductor plating step by incorporating a specified polymer, a specified polymerizable monomer and p-aminophenyl ketone into a photosensitive resin layer. SOLUTION: The photosensitive resin laminated body comprises a substrate and a photosensitive resin layer containing 20-90 wt.% polymer having a carboxyl content of 100-600 (expressed in terms of acid equivalent) and a weight average molecular weight of 20,000-500,000, 10-60 wt.% one or more polymerizable monomers including at least a compound of the formula and 0.001-0.1 wt.% at least one p-aminophenyl ketone. In the formula, X is H, methyl or hydroxy A is a residue of a copolymer of CH2CH(CH3)O and CH2CH2O, (n) is an integer of 0-5 and R is H or methyl. A compound having one (meth) acrylic ester group called a monofunctional monomer is used. |
