POLYMER MATERIAL, FOAM OBTAINED FROM SAME, AND POLISHING PAD USING THOSE

摘要

Disclosed is a polymer material which enables to improve flatness and planarization efficiency of a polished surface and is useful as a polishing pad which generates only a few scratches. Specifically disclosed is a polymer material having a tensile modulus at 50°C of 130-800 MPa after saturation swelling with water at 50°C, a loss tangent at 50°C of not more than 0.2, and a contact angle with water of not more than 80 degrees.