| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inspection device that inspects the status of pasted sheet on a plate-like member such as a semiconductor wafer, and to provide a sheet pasting apparatus. <P>SOLUTION: The sheet pasting apparatus 10 includes: a pasting means 13 for pasting an adhesive sheet S on the semiconductor wafer W; and an inspection device 21 for detecting the total thickness of the semiconductor wafer after pasting the sheet and the adhesive sheet, or the surface status of the adhesive sheet. The inspecting device 21 includes an optical sensor 51 and a camera 70 as an inspecting means for detecting the thickness and surface status. The inspection data based on the inspection device is output to a first information storage processing means 52, and the data subjected to predetermined processing in the first information storage processing means 52 is input into a second information storage processing means 53 attached on a case 60 for housing the semiconductor wafer W. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
