| 摘要 |
A stacked-type wafer level package includes a semiconductor chip through which a hole is formed, a conductive pattern and a conductive bump. The conductive pattern includes a conductive trace formed on an upper face of the semiconductor chip and electrically connected to the semiconductor chip, and a conductive pad extending from the conductive trace through the hole. The conductive pad is not protruded from a lower face of the semiconductor chip. The conductive bump is positioned on the conductive trace over the conductive pad. |
