Halbleiterchip-Gehäuse und Verfahren zur Herstellung desselben
摘要
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
申请公布号
DE112006001663(T5)
申请公布日期
2008.05.08
申请号
DE20061101663T
申请日期
2006.06.19
申请人
FAIRCHILD SEMICONDUCTOR CORP.
发明人
JEON, OSEOB;CHOI, YOONHWA;GOOI, BOON HUAN;ESTACIO, MARIA CRISTINA B.;CHONG, DAVID;KENG, TAN TEIK;NAM, SHIBAEK;JOSHI, RAJEEV;WU, CHUNG-LIN;IYER, VENKAT;LIM, LAY YEAP;LEE, BUYONG-OK