POKE-THROUGH FLOOR DEVICE WITH HEAT-ISOLATION FEATURE

摘要

A poke-through device for installation in a hole in a floor structure. The floor structure defined by a floor in a first working environment and a ceiling in a second working environment. The poke-through device includes a basket, thermal barrier, lower plate and at least one coupling member. The basket including a coupling support surface. The thermal barrier being disposed below the basket. The lower plate supporting the thermal barrier. Also, the at least one coupling member extending through the thermal barrier and securing the basket to the lower plate. The coupling member including an upper portion disposed within the basket. The upper portion including an undersurface, wherein a first portion of the undersurface is in direct contact with the support surface and a second portion of the undersurface does not directly engage the basket.