| 摘要 |
A moldable capsule device ( 1 ) includes a bundle of micron conductive fiber ( 3 ) and a resin-based material layer ( 5 ) overlying the bundle along the length (L) of the capsule wherein thickness of the resin-based material layer is not uniform (T 1 and T 2 ). A method ( 100 ) to form a moldable capsule ( 1 ) including extruding/pultruding a resin-based material layer ( 5 ) onto the length (L) of a bundle of micron conductive fiber ( 3 ). The resin-based material layer ( 5 ) has a first thickness (T 1 ) and a second thickness (T 2 ). The first thickness (T 1 ) is disposed around multiple first surfaces ( 7 ) of the bundle. The second thickness (T 2 ) is disposed around multiple second surfaces ( 9 ) of the bundle. The second thickness (T 2 ) is at least twice that of the first thickness (T 1 ). The extruded/pultruded resin-based material and bundle are section into moldable capsules.
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