发明名称 THERMAL DIODIC DEVICES FOR HIGH COOLING RATE APPLICATIONS AND METHODS FOR MANUFACTURING SAME
摘要 Thermal transfer devices and methods for manufacturing. A thermal diode Includes a device capable of controllably transferring thermal energy in one direction from one portion of the device to another portion of the device and to resist the transfer of thermal energy in the opposing direction. A metallic layer, e.g. silver, is applied to a substrate. The substrate has metallic, metallic coated or highly doped regions. The regions control the flow of current between devices that are bulit on the substrate.
申请公布号 WO2007089874(A3) 申请公布日期 2008.03.06
申请号 WO2007US02708 申请日期 2007.01.31
申请人 SOLID STATE COOLING, INC. 发明人 FLITSCH, FREDERICK, A.;WRIGHT, LLOYD;YOUNG, LLOYD
分类号 H01L23/34 主分类号 H01L23/34
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