| 摘要 |
PROBLEM TO BE SOLVED: To faithfully and sharply reproduce a circuit pattern of an exposing mask. SOLUTION: The thick-film resist process coats the surface of a silicon substrate (S) with a resist (L), exposes the resist (L) to a circuit forming pattern to print the pattern thereto, and develops the resist (L) printed with the circuit pattern. The resist (L) is exposed after giving a water content to the resist (L), thereby indeneketen is quickly and massively formed by the water content of the resist (L), and the indenketene is changed to indenecarbonate soluble to an alkali developing solution due to the water content of the resist (L), thus achieving extremely faithful exposure/development on an exposing mask (M). COPYRIGHT: (C)2008,JPO&INPIT |
