| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment method for a polyimide resin layer which, while assuring adhesive strength sufficient even to answer the fine pitch requirement of a printed circuit board, can also meet the materialization of making an insulating resin layer ultrathin, and to provide a method for producing a metal-clad laminated plate. SOLUTION: There is formed a modified layer on the surface of a polyimide resin layer by the process (a) of forming an alkali-treated layer by treating the surface side layer of the polyimide resin layer with an aqueous alkali solution, the process (b) of impregnating the face of the alkali-treated layer with a polar solvent solution containing an aromatic amino compound and drying it to form a layer containing the aromatic amino compound, and the process (c) of subjecting the layer containing the aromatic amino compound to imidization treatment to form the modified imidized layer. By bonding a metal foil onto this modified layer under heat and pressure (d) there is obtained the metal-clad laminated plate. COPYRIGHT: (C)2008,JPO&INPIT |
