发明名称 Packaging apparatus, packaging method, packaging system
摘要 The present invention provides a packaging apparatus ( 1 ) capable of adjusting the thickness of a package with a simple configuration. The packaging apparatus ( 1 ) is a packaging apparatus that manufactures a package (B) wherein articles to be packaged, such as foodstuffs, and gas are sealed in a bag, and comprises a cooling unit ( 6 ). The cooling unit ( 6 ) cools the gas sent to a tubular film (F) formed in a bag shape. The packaging apparatus ( 1 ) manufactures the package (B) wherein the gas, having a temperature lower than the outside air, and the articles to be packaged are sealed.
申请公布号 US7313901(B2) 申请公布日期 2008.01.01
申请号 US20050522612 申请日期 2005.07.14
申请人 ISHIDA CO., LTD. 发明人 KAKITA YUKIO;NAKAGAWA YUKIO;ASAHINA AKIRA
分类号 B65B31/02;B65B9/20;B65B31/04;B65B57/00 主分类号 B65B31/02
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