| 发明名称 |
Lead frame and its manufacturing method |
| 摘要 |
<p>The semiconductor device mounting surface and substrate mounting surface of a metallic sheet (1) of a lead frame are plated with palladium (1a). The formed lead part, pad part, no-mounting surfaces, and side faces are not plated.</p> |
| 申请公布号 |
HK1069010(A1) |
申请公布日期 |
2007.12.07 |
| 申请号 |
HK20040110373 |
申请日期 |
2004.12.31 |
| 申请人 |
SUMITOMO METAL MINING CO., LTD. |
发明人 |
KAZUNORI LITANI;YOUCHIROU HAMADA |
| 分类号 |
H01L;H01L21/48;H01L23/495 |
主分类号 |
H01L |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
