发明名称 Replication of a High-Density Relief Structure
摘要 The invention relates to a method for manufacturing a reverse mold ( 2, 4 ) for replicating a high-density relief structure ( 1 ), to such a reverse mold ( 2, 4 ) and to a method for replicating of such a high-density relief structure ( 1 ). To provide an improved and reliable method for the best possible replication of a high-density relief structure (1) a method for manufacturing a reverse mold ( 2, 4 ) for replicating a high-density relief structure ( 1 ) is proposed comprising the steps of: applying a curable polymer to a surface of said high-density relief structure ( 1 ) having surface shape information to be replicated, thus forming a layer ( 2 ) of curable polymer on said surface of said high-density relief structure ( 1 ), curing of said polymer to form a reverse mold ( 2, 4 ), and separating said reverse mold ( 2, 4 ) from said high-density relief structure ( 1 ).
申请公布号 US2007278704(A1) 申请公布日期 2007.12.06
申请号 US20050574597 申请日期 2005.09.02
申请人 KONINKLIJKE PHILIPS ELECTRONICS, N.V. 发明人 MEINDERS ERWIN R.
分类号 B29C33/40;B29C35/08;B29C67/00;B29D11/00 主分类号 B29C33/40
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