| 摘要 |
PROBLEM TO BE SOLVED: To provide an appropriate transfer amount at every type of an electronic component. SOLUTION: When a next electronic component taken out from a component supply device 16 and mounted on a printed board 18 is to transfer flux, CPU 60 reads film thickness data of the next electronic component stored in RAM 62 after transfer of flux to a bump electrode 9A of present BGA 9 is terminated, controls a driving motor 55 through a driving circuit 65, sets a height position of a squeegee 50 which follows film thickness data, rotates a rotation disk 40, and makes flux on the rotation disk 40 smooth. When the next electronic component does not transfer flux, the electronic component transferring flux is adsorbed from the component supply device 16 and is taken out. CPU 60 reads film thickness data of the electronic component, controls the driving motor 55, sets the height position of the squeegee 50 which follows film thickness data, and makes flux on the rotation disk 40 smooth by the squeegee 50. COPYRIGHT: (C)2008,JPO&INPIT |
