| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a high-performance resin sealing structure by specifying a shape of an element side and controlling the flow of a resin in the case of supplying the liquid resin. <P>SOLUTION: The sealing structure is obtained by coating the element of a prescribed structure with the liquid resin, and curing the resin for sealing. In the sealing structure, the height of a connection lead 12 on a substrate 10 is equalized to the periphery of the connection lead 12 at one or more places. Thus, there is no longer a level difference on both of the side faces of the connection lead 12, so that the resin never flows along the connection lead. As the result of this, flowing of the liquid resin toward a function area is avoided at the place, so that a section which has to be prevented from being sealed with the resin is no longer sealed with the resin. <P>COPYRIGHT: (C)2008,JPO&INPIT |
