| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate with a built-in electronic component which has a structure capable of establishing interlayer connection by easily burying a conductive body into via hole formed at an insulating layer of a thick film into which the electronic component is buried. <P>SOLUTION: Electronic components 41, 42 and 43 are mounted to a body 5 to be mounted which has a first wiring layer 12, while the electronic components 41, 42 and 43 are buried into an insulating layer 25, and a conductive ball 30 is arranged so as to penetrate the insulating layer 25 and connected to the first wiring layer 12 electrically. A second wiring layer 14 connected electrically to the conductive ball 30 is formed on the insulating layer 25, whereby the interlayer connection of the first wiring layer 12 and the second wiring layer 14 is established through the conductive ball 30. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
