| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for boring small-diameter through holes on a thin ferrite substrate by blast-processing, and a device used for it. SOLUTION: This boring method, and a blast device performing this method are characterized in that small-diameter through holes are bored by adhering a thin ferrite substrate on a pedestal plate by a heat-exfoliation foamed sheet, and a blast processing via an anti-blast resist pattern-molded by a photolithography. This device comprises means for controlling a plurality of nozzles emitting compressed air mixed with blast-processing particles to move across different paths on a workpiece plural times. COPYRIGHT: (C)2008,JPO&INPIT
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