| 摘要 |
A scratch preventing polishing pad for a chemical mechanical polishing process is provided to reduce scratch on a wafer by automatically cleaning a diamond disk during pad conditioning. A chemical mechanical polishing system includes a main body, a polishing pad(110), a head, and a polishing pad conditioner. The polishing pad has an edge with a disk cleaning section(300). The disk cleaning area removes slurry and other substances which cause scratch on a wafer, from the polishing pad conditioner. A gap(400) is formed between the disk cleaning area and the polishing pad to prevent slurry or substances removed by the disk cleaning area from entering the polishing pad. |
