| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing molding apparatus for an electric component which can mainly improve the strength of a component single body and quality in accuracy in a press structure, and can improve productivity in a sealed substrate (product). SOLUTION: This apparatus 100 is configured so that a given portion for applying a given mold fastening pressure to its mold 51(52, 53) is held by a hold frame (press frame) 77 having a frame-shaped frame structure. Also, the apparatus 100 is configured so that the required numbers of hold frames (press frames) 77 are coupled and arranged attachably/detachably. COPYRIGHT: (C)2008,JPO&INPIT |
