| 摘要 |
An apparatus ( 100 ) and method are provided for thermally processing substrates ( 108 ) held in a carrier ( 106 ). The apparatus ( 100 ) includes a vessel ( 101 ) having a top ( 134 ), side ( 136 ) and bottom ( 138 ), and a heat source ( 110 ) with heating elements ( 112 - 1, 112 - 2, 112 - 3 ) proximal thereto. The vessel ( 101 ) is sized to enclose a volume substantially no larger than necessary to accommodate the carrier ( 106 ), and to provide an isothermal process zone ( 128 ) extending throughout. In one embodiment, the bottom wall ( 138 ) includes a movable pedestal ( 140 ) with a bottom heating element therein ( 112 - 1 ), and the pedestal can be lowered and raised to insert the carrier ( 106 ) into the vessel ( 101 ). The apparatus ( 100 ) can include a movable shield ( 146 ) that is inserted between the pedestal ( 140 ) and the carrier ( 106 ) to shield the substrates ( 108 ) from the heating element ( 112 - 1 ) and to maintain pedestal temperature. A magnetically coupled repositioning system ( 162 ) repositions the carrier ( 106 ) during processing of the substrates ( 108 ) without use of a movable feedthrough into the volume enclosed by the vessel ( 101 ), and without moving the bottom heating element ( 112 - 1 ) in the pedestal ( 140 ).
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