| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for a semiconductor device composed by reducing the difference between degrees of deformation of contacts adjacent to each other and thereby preventing the contacts adjacent to each other from being short-circuited to each other. SOLUTION: This socket for a semiconductor device is provided with at least a socket body, a floating plate vertically movable with respect to the socket body and having a mounting surface for mounting the semiconductor device thereon, a plurality of contacts each having a horizontally projecting elastic deformation part, and each having a vertically movable contact part contacting with an external contact of the semiconductor device, and a pressing body for depressing the semiconductor device and the floating plate. The floating plate has a plurality of through-holes which the external contacts of the semiconductor device face from the upper side thereof and into which contact parts of the contacts are inserted from the lower side thereof; a first step is formed in each through-hole; a projecting part located below the first step is formed in each of the plurality of contacts; and the distance between the first step and the projecting part is set at a predetermined value. COPYRIGHT: (C)2008,JPO&INPIT
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