发明名称 IDENTIFICATION METHOD FOR THAT CHIP MOUNTER ADSORBS PARTS
摘要 A method for identifying absorption of parts of a chip mounter is provided to prevent an error of a printed circuit board and a reduction of a production yield due to the missing of the parts by recognizing the absorption of the parts on a nozzle. A method for identifying absorption of parts of a chip mounter includes the steps of: picking up the parts by a nozzle(S10); acquiring an image having the nozzle by a photographing apparatus located on a lower part of the nozzle(S12), and then indicating an inspection region(S14); performing a binarization through thresholding for the inspection region(S16); extracting information for an outer edge region within the inspection region by performing a labeling work in the inspection region where the binarization is carried out(S20); separating an inner region by performing the binarization for the outer edge region(S22); comparing a characteristic value of an internal region with the outer edge region(S24); and determining whether the parts are absorbed on the nozzle by analyzing whether the comparison result is mated with predetermined reference data of the nozzle(S26).
申请公布号 KR20070100022(A) 申请公布日期 2007.10.10
申请号 KR20060031551 申请日期 2006.04.06
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 ROH, KYEONG WAN
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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