| 摘要 |
PROBLEM TO BE SOLVED: To design a probe card by which an increase in needle setting cost can be suppressed as much as possible, and all semiconductor chips that are formed by least number of indices on a wafer can be tested. SOLUTION: Unit areas (chip areas) 11-14 are made adjacent to by only equal number to the number of indices so as to constitute chip group areas 10, and a chip area forming one unit area among the group areas is set to a specific chip area (chip area 11). Next, chip group areas 10 are tightly arranged in a manner not to be overlapped, so as to form a virtual cover pattern that can cover all the semiconductor chips on the wafer. If probe needle assemblies are arranged corresponding to each of the specific chip areas on the virtual cover pattern, the arrangement pattern can be obtained in the probe needle assembly having an appropriate spacing and a nearly circular outer shape. COPYRIGHT: (C)2007,JPO&INPIT
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