| 摘要 |
A competitive, simple, single-substrate wafer-level packaging technique capable of creating a vacuum-sealed protective cavity around moving or other particular components of a MEMS is described. The technique uses common semiconductor materials, processing steps and equipment to provide a stable vacuum environment of, for example less than 1Pa, in a sealed cavity. The environment protects components of the MEMS against micro-contamination from particles and slurry of a waver dicing process and against fluctuations of atmospheric condition to ensure long term reliability. <IMAGE> |
