| 摘要 |
<p>Semiconductor manufacturing equipment and a semiconductor device manufacturing method are provided to improve processing efficiency by reducing the loss of a working time using an edge exposure unit of a scanner capable of performing simultaneously a WEE(Wafer Edge Exposure) and a pre-aligning process. Semiconductor manufacturing equipment includes a spinner(100) for performing a coating process and a developing process on a wafer, a scanner(300) for performing an exposure process on the wafer, and an interface unit(200) for transferring the wafer between the spinner and scanner. The scanner is composed of an edge exposure unit and an exposure unit. The edge exposure unit(330) performs the exposure process on a photoresist layer coated on an edge portion of the wafer. The edge exposure unit is capable of aligning the edge exposed wafer before a final alignment for exposure. The exposure unit(350) forms a predetermined pattern on the wafer.</p> |
