| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor memory card for improving responsiveness, for reducing power consumption, and for reducing cross-talk between substrate wiring. <P>SOLUTION: This semiconductor memory card 100 is provided with a circuit board 3 formed with an input/output card terminal 22, a power source card terminal 23 and a ground card terminal 24 on the lower face; an almost rectangular non-volatile memory chip 6 to which a plurality of first substrate terminals 1 formed on the upper face of the circuit board 3 are wire-bonded; and a controller chip 9 to which a plurality of second substrate terminals 2 formed on the upper face of the circuit substrate 3 are wire-bonded. The power source card terminal 23 or the ground card terminal 24 is provided with connection parts 23a and 24a connected to an external device and extended parts 23b and 24b extended from the connection parts 23a and 24a so that they can go along the first substrate terminal 1 and the second substrate terminal 2 through the circuit board 3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
