| 摘要 |
PROBLEM TO BE SOLVED: To provide a constitution capable of increasing the soldering strength to a substrate in an electronic component, enabling a surface mounting by superposing an insulating plate on the end face of a lead-wire electronic body. SOLUTION: A chip-type electrolytic capacitor 1 enables surface mounting of an electrolytic capacitor body 2 by the insulating plates 5. In the chip-type electrolytic capacitor 1, trenches 58, extending lead wires 24 on the lower end faces 50 of the insulating plates 5 toward the outer peripheral side from the inside, are constituted of narrow-width sections 581, on the inside to be slightly broader than the line diameters of the lead wires 24 and broad-width sections 582 on the outer peripheral side having broad widths. Consequently, gaps 6, among the inner walls 59 of the trenches 58 and the lead wires 24, are also composed of the narrow-width sections 61 on the inside and the broad width sections 62 on the outer peripheral side broader than the narrow width sections 61, and the fillets of a solder are formed surely by the broad width sections 62, when the chip-type electrolytic capacitor 1 is mounted. COPYRIGHT: (C)2007,JPO&INPIT
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