Thermosiphon for electronics cooling with high performance boiling and condensing surfaces

摘要

A thermosiphon (12) for cooling an electronic device (8) having a mean width of dimension "b" (9) comprises a boilerplate (30) having a top surface (33) and including a plurality of pyramid shaped fins (40) projecting upwardly from the top surface (33). The boilerplate also has a bottom surface (32) for receiving the electronic device (8) to be cooled. A plurality of spaced apart condenser tubes (42) is mounted above the boilerplate (30) such that the boilerplate (30) and the condenser tubes (42) define a vapor chamber (54) therebetween for receiving a working fluid therein. A plurality of convoluted fins (58) extends between each adjacent pair of condenser tubes (42).