发明名称 POLISHING PAD
摘要 <p>A polishing pad which little suffers from the clogging of grooves with abrasive grains or tailings in polishing and is not lowered in the rate of abrasion even in long-time continuous use, that is, a polishing pad having a polishing layer which is made of a polyurethane resin foam having fine cells and whose polishing surface has an uneven structure, characterized in that the polyurethane resin foam is a product of curing of an isocyanate-terminated prepolymer containing both a high -molecular polyol component and an isocyanate component with a chain extender and contains a silicon-containing surfactant having a combustion residue of 8% by weight or above.</p>
申请公布号 WO2007080848(A1) 申请公布日期 2007.07.19
申请号 WO2007JP50072 申请日期 2007.01.09
申请人 TOYO TIRE & RUBBER CO., LTD.;FUKUDA, TAKESHI;HIROSE, JUNJI;DOURA, MASATO 发明人 FUKUDA, TAKESHI;HIROSE, JUNJI;DOURA, MASATO
分类号 B24B37/20;B24B37/24;C08G18/00;C08G18/10;H01L21/304 主分类号 B24B37/20
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