| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board capable of efficiently manufacturing a thin and high-density wiring board. SOLUTION: The method for manufacturing the wiring board comprises steps of adhering an adhesive agent layer 2, with its adhesive force vanishing or lowering due to heat on the main surface of a support substrate 1 having a flat main surface, forming laminated body 10 for wiring board, comprising conductive layers 3, 5a, 5b, 5c, 5d and insulating layers 4a, 6a, 6b, 6c, 4b by altenately laminating the plurality of layers 3, 5a, 5b, 5c, 5d and the plurality of layers 4a, 6a, 6b, 6c, 4b on the dhesive layer 2, vanishing or lowering the adhesive power of the layer 2 by heating the layer 2, and exfoliating the body 10 from the layer 2, with its adhesive power being vanished or lowered. COPYRIGHT: (C)2007,JPO&INPIT |
