METHOD OF MANUFACTURING FLEXIBLE WIRING SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT MOUNTING STRUCTURE

摘要

A method of manufacturing a flexible wiring substrate and a method of manufacturing an electronic component mounting structure are provided to easily respond to the progress of a fine pitch of via-holes and wiring patterns and to a multi-layered structure. A tape-like substrate(10) with a resin layer(10a) and a reinforcing metal layer(10b) provided on a lower surface of the resin layer is prepared. The resin layer of the tape-like substrate is processed to form a via-hole. A seed layer(12) is formed in the via-hole and on the resin layer. A resist film having an opening is formed in an area containing the via-hole on the seed layer. The seed layer is subjected to electroplating to form a metal layer from the via-hole to the opening of the resist film, and the resist film is removed. The seed layer is etched to form wiring patterns which are connected to the reinforcing metal layer through the via hole.