BONDING METHOD AND ADHESIVE

摘要

PROBLEM TO BE SOLVED: To provide a bonding method capable of forming a pattern of an adhesive layer on part of a bonding surface in a high position accuracy and a high thickness accuracy and capable of providing high productivity. SOLUTION: A method for bonding two adhrends 1 and 2 together through parts of their respective opposing bonding surfaces. This method comprises the successive steps of: forming an adhesive layer 3 from an adhesive on the bonding surface of one adherend 1, exposing the adhesive layer 3 to light by irradiation with light through a negative photomask 4 to change the part irradiated with light into a stage B heat-sensitive adhesive layer 5, removing the area not irradiated with light in the light exposure by developing it, and heating the heat-sensitive adhesive layer 5 remaining after the development after contact with the bonding surface of the other adherend 2. COPYRIGHT: (C)2007,JPO&INPIT