发明名称 WIRING BOARD, AND ELECTRONIC APPARATUS AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a reliable electronic apparatus and its manufacturing method, and to provide a wiring board which allows for the manufacture of a reliable electronic apparatus efficiently. SOLUTION: The electronic apparatus is comprised of a wiring board 100, an electronic component 30, a resin for partially coating the wiring board 100, and a coat 50. The wiring board comprises a base substrate 10, and a wiring pattern 12 including a plurality of electric connectors 14 which is formed on the surface of the base substrate 10. The electronic component 30 includes a plurality of conductors 32 which face the individual electric connectors 14, and are electrically connected thereto. The coat 50 is formed of a less hygroscopic material than the base substrate 10, and coats the wiring pattern 12 on the surface of the base substrate 10 and all the part exposed from the resin. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007149767(A) 申请公布日期 2007.06.14
申请号 JP20050338952 申请日期 2005.11.24
申请人 SEIKO EPSON CORP 发明人 UDA TOMOHIKO
分类号 H05K3/28;H01L21/56 主分类号 H05K3/28
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