| 发明名称 |
Slurry for chemical mechanical polishing |
| 摘要 |
The present invention relates to a slurry for chemical mechanical polishing, which contains a silica polishing material, an oxidizing agent, a benzotriazole-based compound, a diketone and water. |
| 申请公布号 |
US7229570(B2) |
申请公布日期 |
2007.06.12 |
| 申请号 |
US20030616914 |
申请日期 |
2003.07.11 |
| 申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
TAIJI TOSHIJI;TSUCHIYA YASUAKI;ITO TOMOYUKI;AOYAGI KENICHI;SAKURAI SHIN |
| 分类号 |
B24B37/00;C09K13/00;C09G1/02;C09K3/14;C09K13/06;H01L21/302;H01L21/304 |
主分类号 |
B24B37/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
