| 摘要 |
<p>PURPOSE: A semiconductor package is provided to simplify a fabricating process and reduce a production cost by mounting two diodes on separative pads, respectively. CONSTITUTION: The first and the second diodes(110,120) are mounted on each pad(211,221) of a lead frame(200) by using a welding method. An anode electrode(111) of the first diode(110) is connected with the first lead(311) by a wire(310). An anode electrode of the second diode(120) is connected with the first pad(221) by a wire(320). The second lead(312) and the third lead(313) are connected with each cathode electrode(112,122) of the first and the second diodes(110,120). An equivalent circuit is formed by connecting the anode electrode of the second diode(120) with the first pad(221). In addition, a heat emission effect is improved since the second lead(312) and the third lead(313) are connected with the first and the second pads(211,221).</p> |
