发明名称 HEAT TRANSPORT APPARATUS AND ELECTRONIC INSTRUMENT
摘要 PROBLEM TO BE SOLVED: To provide a heat transport apparatus which carries out large capacity heat transport while the apparatus is miniaturized and thinned, and also to provide an electronic instrument mounted therewith. SOLUTION: A plurality of first tabular bodies 17 arranged in a direction substantially orthogonal to both of an arrangement direction of a cover plate 9 and a base plate 10, and an arrangement direction of an evaporator 3 and a condenser 5, is provided to form a first gap 18 for communicating a condensed working fluid to the evaporator 3. Accordingly, capillary force is easily increased by narrowing intervals between the first tabular bodies 17, and reducing the first gap 18. It is also easy to reduce a thickness in the arrangement direction of the cover 9 and the base plate 10 comprising a casing 2 by numerously arranging the plurality of first tabular bodies 17 in its arrangement direction. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007113864(A) 申请公布日期 2007.05.10
申请号 JP20050306833 申请日期 2005.10.21
申请人 SONY CORP 发明人 NAGAI HIROYUKI;YOSHITAKA HIROYUKI;HASHIMOTO MITSUO;YAJIMA TAKASHI
分类号 F28D15/02;H01L23/373;H01L23/427;H05K7/20 主分类号 F28D15/02
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