| 摘要 |
<p>A substrate processing method includes: performing an etching process to form a predetermined pattern on an etching- target film disposed on a substrate; denaturing a substance remaining after the etching process to be soluble in a predetermined liquid; then, performing a silylation process on a surface of the etching-target film having the pattern formed thereon; and then, supplying the predetermined liquid to dissolve and remove the denatured substance.</p> |
